1.3-layer PCB with Blind and Buried Via, 2. PI Stiffener and EMI Conductive Layer, 3.Green LPISM Base material: 1/2mil PICCL: 1/2mil PI, 1/3oz, adhesiveless, double ED copperCopper foil: 1oz RA copperCover layer: 1/2mil, 25umSurface treatment: ENIGStiffener: PISolder mask: green inkConductive layer: EMIRoHS compliant