... C/100g)20minsSolidifying environmentRoom TemperatureMix Ratio4:1PropertiesFast curing, fine flexibility, low viscosity, high ... , adhesives, firber glass moulding, electronic encapsulation glue packing,etc.Item : epoxy hardener R-2252Product ... )4.0hoursSolidifying environmentRoom TemperatureMix Ratio2:1PropertiesDurable, fast-curing in later period, bright luster of condensateApplicationtemperature ...