fexible polyimide fpc soldering
1.Prompt Delivery
2.High quality
3.Green products
4 RoHS;GS,SGS

fexible  polyimide fpc solderingfexible  polyimide fpc solderingfexible  polyimide fpc solderingfexible  polyimide fpc solderingCapability Min. Trace width: 0.3 mm 
Min. Space between trace: 0.1 mm
Large size of circuit: 250.00X550.00 mm
Board thinckness: 0.085-0.4mm
Hole Diameters: 0.25mm-6.50mm
Base Copper Wt.: 18um-35um 

 

A quick view of our processing line

 

 

FPC(flexible board) Any kinds PCBs from 1 to maximum 16  Specializing in high-tech multilayer  Large production capability  Professional engineering assistance, including design rule check of customer data  In-house PCB R and D center  Quick turnaround 

 

 

  If you are interested in our products, please feel free to contact me. Thank you.

 

 

 

 

 

Layers	1-8
Panel Size	Max:250*550(mm)
Drilling Diameter	Max.Diameter:6.5mm Min.Diameter:0.2.mm
Base Material Copper Thickness	Max.:0.105mm Min.:0.012mm
Insulating Layer Thickness	Max.:0.05mm(PI) Min.:1.0125mm(PI)
Electroplating Sn/Pb Thickness	3um---20um
Chemical Immersion Ni/Au Thickness	0.05µm---0.1µm
Electroplating Au Thickness	».005µm
Electroplating Sn Thickness	3µm---20µm
Etching Line Width&Space	S/S:2.5mil D/S:2.5mil
Etching Tolerance	Width:±20% Special:±10%
Outline Tolerance	±0.1mm(±2mil)
Parts Fixed Position Tolerance	±0.2mm
Finishing Treatment	Immersion Gold, Immersion Tin Plating Gold, Plating Tin OSP, etc.
Soldermask	Green,White,Black
E-Testing	100% E-Testing (High Voltage Testing);  Flying Probe testing
Other test	ImpedanceTesting,Resistance Testing,  Microsection etc.,