2011 hot item, selective printed circuit board
1.Fast Delivery
2.Competitive Price
3.Green products
4 RoHS,UL,SGS
2011 hot item, selective printed circuit board 2011 hot item, selective printed circuit board2011 hot item, selective printed circuit board2011 hot item, selective printed circuit board
Flex-rigid PCB,PCB board,flexible PCB board,PCB manufacturer.FPC up to 8layers, PCB UP TO 20 LAYERES. copy PCBA/PCB/FPC,PCB/FPC design,FPC,circuit board
SMT, OEM servive is provided.
Producing capability is listed as following:
| Layers | 1-8(rigid-flex board) |
| Panel Size | Max:250*550(mm) |
| Drilling Diameter | Max.Diameter:6.5mm Min.Diameter:0.2.mm |
| Base Material Copper Thickness | Max.:0.105mm Min.:0.012mm |
| Insulating Layer Thickness | Max.:0.05mm(PI) Min.:1.0125mm(PI) |
| Electroplating Sn/Pb Thickness | 3um---20um |
| Chemical Immersion Ni/Au Thickness | 0.05µm---0.1µm |
| Electroplating Au Thickness | ».005µm |
| Electroplating Sn Thickness | 3µm---20µm |
| Etching Line Width&Space | S/S:2.5mil D/S:2.5mil |
| Etching Tolerance | Width:±20% Special:±10% |
| Outline Tolerance | ±0.1mm(±2mil) |
| Parts Fixed Position Tolerance | ±0.2mm |
| Finishing Treatment | Immersion Gold, Immersion Tin Plating Gold, Plating Tin OSP, etc. |
| Soldermask | Green,White,Black |
| E-Testing | 100% E-Testing (High Voltage Testing); Flying Probe testing |
| Other test | ImpedanceTesting,Resistance Testing, Microsection etc., |
Specializing in high-tech multilayer Large production capability Professional engineering assistance, including design rule check of customer dataFast delivery with good price performance ratio
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