1.capable of scribing/drilling max. 2.5mm ceramic wafer.
2.Auto programming
3.Auto cooling
4.CNC control

Our ceramic scribing machine is specially designed for ceramic scribing/drilling. Capable of scribing/drilling thickness of ceramic wafer: up to 2.5mm.

SUITABLE LASER SYSTEM:

Model:                           YMS-10                     YMG-5                           YMS-10F

Scribing spees,mm/s:     40-80                           30-60                       60-150(cutting through)

Min kerf width,mm:          0.06                              0.02                                 0.04

CNC worktable precision,mm:                       0.01

System control:                             Auto programming, auto cooling, simple and easy

Cooling:                       Water-cooled                                Air-cooled

System cost:                   Low                            Medium                           High