1.High performance
2.Excellent wetting
3.Clean pin probe testable
4.RoSH
5.Easy to take
Stand lead free soldering paste composition
Application Method | IPC Powder Type | Metal load |
Standard Stencil Printing | 3 | 90% |
Fine Pith Stencil Printing | 5 | 89.5% |
UItra-Fine Pitch Stencil Printing | 5 | 89% |
Dispensing syringes | 3 | 85% |
Note:These typical starting guide lines.To achieve optimal performance, actual metal load and particle size may vary per process, application, and envitonment. | ||
Ingedient | Wt% | Chemical Formula | CAS No. |
Tin | 96.5±0.5 | Sn | 7440-31-5 |
Silver | 3.0±0.5 | Ag | 7440-22-4 |
Copper | 0.5±0.1 | Cu | 7440-50-8 |
Lead | ≤0.05 | Pb | 7439-92-1 |
Stibium | ≤0.05 | Sb | 7440-36-0 |
Bismuth | ≤0.10 | Bi | 1304-85-4 |
Zinc | ≤0.002 | Zn | 5970-45-6 |
Aluminium | ≤0.002 | Al | 637-12-7 |
Cadmium | ≤0.002 | Cd | 7440-43-9 |
Modified Rosin A | 38.0±0.5 | - | 65997-05-09 |
Modified Rosin B | 16.0±0.5 |
| - |
Organic Solvent | 46.0±0.5 |
| - |
